The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Dec. 20, 1996
Takatoshi Nakahira, Osaka, JP;
Tetsuo Setoguchi, Osaka, JP;
Masaaki Yoshikawa, Osaka, JP;
Akira Kishimoto, Osaka, JP;
Akio Chikazawa, Osaka, JP;
Mamoru Ishiguro, Tokyo, JP;
Yasunori Nakanishi, Nishinomiya, JP;
Shigehiro Maeda, Tokyo, JP;
Yukihiko Akamatsu, Hirakata, JP;
Osaka Gas Co, Ltd, , JP;
Abstract
Heat-accumulating microcapsule dispersion includes a microcapsule provided as a small-diameter heat-accumulating material including organic compound functioning as heat accumulating material in association with a phase change thereof accommodated within a microcapsule, heat transfer fluid medium including a number of the microcapsules dispersed stably therein, and a number of thermal boundary layer stirring particles dispersed in the heat transfer fluid medium. The stirring particles has a volume average particle diameter between 0.1.times.D and 1.9.times.D relative to a layer thickness D of a thermal boundary layer formed inside a heat exchanging passage through which the dispersion is caused to flow. The particles stir the thermal boundary layer in association with movement thereof inside the heat exchanging passage.