The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Oct. 30, 1997
Kathryn H Varian, Hopewell Junction, NY (US);
James T Varian, Hopewell Junction, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
In a chemical-mechanical-polishing (CMP) process, semiconductor substrates are rotated against a polishing pad covered by a layer of polishing slurry. A polishing pad maintenance apparatus is developed to reduce glazing effects, enhance the pad's operating life, achieve uniform planarity through a constant polishing rate, and minimize scratches or other defects from the polished surface, during a chemical-mechanical polishing process. This invention combines both the removal of particles and debris while effectively conditioning the pad surface. The polishing pad maintenance apparatus performs three main functions: loosening particles and debris; conditioning the polishing pad; and, removing the remaining particles and debris that result from the slurry and conditioning processes. The three functions are performed in sequence by a forced fluid spray, an abrasive mechanical agitator, and a vacuum. A conditioning housing assembly supports the three components that perform the maintenance functions: a) a forced fluid spray assembly; b) a mechanically abrasive plate; and, c) a vacuum attachment assembly.