The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
May. 23, 1996
Hans-Martin Hiller, Friedrichsdorf, DE;
Martin Stratmann, Frankfurt am Main, DE;
Wolfram Debus, Kronberg, DE;
Gunter Oppermann, Dietzenbach, DE;
Friedrich Werhahn, Marktheidenfeld, DE;
Braun Aktiengesellschaft, Frankfurt, DE;
Abstract
A method of mounting an electronic power component to a cooling element includes finishing at least a bonding area of the cooling element with a finish for use during soldering, forming an indentation in the bonding area of the cooling element, placing adhesive in the indentation, attaching the power component to the cooling element using the adhesive, and thereafter soldering the power component to the cooling element. The finishing melts during soldering and the adhesive prevents shifting of the power component on the cooling element during soldering. Alternatively, the power component is attached to a printed circuit board by adhesive bonding prior to soldering.