The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 29, 1999
Filed:
Mar. 28, 1996
Seiko Epson Corporation, Tokyo, JP;
Abstract
A stamp making unit is provided having a structure such that gel photosensitive resin for forming a stamping surface can be protected appropriately and non-cured portions of the photosensitive resin can easily be removed after the stamping surface has been formed. A package capable of satisfactorily storing a stamp making unit of the foregoing type is also provided. The stamp making unit uses photosensitive resin as a base material for forming a stamping surface of a stamp which changes from a gel state to a solid state due to received light. The stamping unit comprises a stock member, photosensitive resin bonded to a surface of the stock member on which the stamping surface is formed and a cover member bonded to a surface of the photosensitive resin having light transmission properties. Adhesion between the photosensitive resin in the gel state and the stock member is weaker than adhesion between the photosensitive resin in the gel state and the cover member. Also, adhesion between the photosensitive resin in the solid state and the stock member is stronger than adhesion between the photosensitive resin in the solid state and the cover member.