The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 22, 1999

Filed:

Dec. 06, 1996
Applicant:
Inventors:

Arjan Noordermeer, Eindhoven, NL;

Marco Schmidt, Eindhoven, NL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 33 ; 438 26 ; 438113 ;
Abstract

Method of manufacturing a laser which is provided with a metal layer and a solder layer as early as in the wafer stage, and which is particularly suitable for so-called epi-down final mounting. An individual laser is obtained in that first a block comprising a row of lasers is formed from the wafer by cleaving, and subsequently the individual lasers are separated from the block. Strip-shaped openings are formed in the metal layer at the areas of end faces to be formed before the block is formed, and subsequently a score is provided in the surface of the semiconductor body in each opening in the longitudinal direction thereof, whereupon the solder layer is provided over the metal layer and over at least part of the openings therein, and the block is subsequently formed through cleaving at the areas of and in the direction of the scores.


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