The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1999
Filed:
Nov. 04, 1998
Raymond G Freuler, Laguna Hills, CA (US);
Gary E Flynn, Coto de Caza, CA (US);
Other;
Abstract
A thermal interface for facilitating heat transfer from an electronic component to a heat sink. According to a preferred embodiment, the thermal interface comprises first and second generally planar substrates that are compressively bonded to one another. The first substrate has outer periphery that defines a first continuous peripheral edge. The second substrate has an outer periphery that defines a second continuous peripheral edge with at least a portion thereof extending beyond the first peripheral edge of the first substrate. An adhesive is deposited upon the portion of the second substrate extending beyond the peripheral edge of the first substrate, and preferably beyond the interface surface between the electronic component and the heat sink such that the thermal interface may be adhesively secured into position without forming an additional layer therebetween. Layers of conformable heat-conducting material are formed upon the outwardly-facing opposed sides of the bonded substrates to enhance the heat transfer from the electronic component to the heat sink.