The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1999
Filed:
Oct. 14, 1997
Zenpei Fukuda, Otake, JP;
Masashi Okamoto, Otake, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A method for forming a resin including the steps of forming a resin by using a resin forming nozzle device while supplying thereto a surface lubricant for mold release, having a viscosity of 0.1 to 1,000 cP during use and a surface tension of 40 dyn/cm or less at a temperature of 25.degree. C., wherein the resin forming nozzle device includes the surface lubricant being continuously introduced to a nozzle face having the discharge openings of resin extrusion orifices, the device further including a feed section for supplying a surface lubricant from the outside, and one or more grooves formed on said nozzle face in positions adjacent to the discharge openings of the nozzle face so that the grooves have a width of 10 to 3,000 .mu.m and a depth of 10 .mu.m or greater and at least one end thereof communicates with the surface lubricant feed section.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile