The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 01, 1999

Filed:

Mar. 14, 1997
Applicant:
Inventors:

Go Sakaino, Tokyo, JP;

Katsuhiko Goto, Tokyo, JP;

Toshitaka Aoyagi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385 49 ; 385 88 ; 385129 ; 385 52 ; 257 93 ; 257 99 ; 359152 ; 359180 ; 156293 ;
Abstract

An optical module includes a substrate having an upper surface and a groove on the upper surface; an optical fiber having a core and an end facet, disposed in the groove of the substrate; an optical semiconductor device having an upper surface and a light interactive area on the upper surface optically coupled to the optical fiber; and a block having a side surface on which the optical semiconductor device is fixed and a lower surface perpendicular to the side surface. The optical semiconductor device is fixed onto the side surface of the block so that the distance from the light interactive area to the lower surface of the block is equal to the distance from the core of the optical fiber to the upper surface of the substrate; and the block is disposed on the substrate, with the lower surface contacting the upper surface of the substrate, so that the light interactive area is opposed to the end facet of the optical fiber. The core of the optical fiber and the light interactive area are accurately aligned with the surface of the substrate as a reference regardless of the thickness of the substrate, resulting in a high coupling efficiency between the optical fiber and the optical semiconductor device.


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