The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Nov. 06, 1997
Yushi Sakamoto, Utsunomiya, JP;
Sumitomo Bakelite Company Limited, Tokyo, JP;
Abstract
The object of the present invention is to provide a paste for bonding a semiconductor, which has excellent low stress and excellent heat conductivity and is useful industrially. The object has been achieved by a heat-conductive paste comprising (A) an epoxy resin which is liquid at room temperature and which has at least two epoxy groups in the molecule, (B) an epoxy group-containing reactive diluent having a viscosity of 100 cp or less at room temperature, (C) a phenolic compound as a curing agent represented by the following general formula (1), which is crystalline at room temperature: ##STR1## wherein R is hydrogen atom or an alkyl group of 1-5 carbon atoms, and (D) a silver powder, wherein the amount of the silver powder (D) is 70-90% by weight of the total paste; the silver powder (D) contains an atomized silver powder consisting of flake-shaped particles having longitudinal lengths ranging from 10.mu. to 50.mu. and thicknesses ranging from 1.mu. to 5.mu., in an amount of at least 30% by weight of the total silver powder; and the paste is produced by first melt-mixing the component (C) with the components (A) and (B) or with the component (B), and then kneading the resulting mixture with the component (D) or with the components (D) and (A).