The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1999
Filed:
Aug. 28, 1997
Applicant:
Inventor:
Tomiya Mori, Kakuda, JP;
Assignee:
Tohoku Ricoh Co., Ltd., Miyagi-ken, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C / ; B32B / ; B32B / ; B41N / ;
U.S. Cl.
CPC ...
428215 ; 10112821 ; 427143 ; 4272554 ; 427411 ; 4283142 ; 4283179 ; 4283197 ; 428903 ; 428913 ;
Abstract
A heat-sensitive stencil including a thermoplastic resin film, and a porous resin layer formed thereon. The porous resin layer contains fibers having an average length in the range of 30 .mu.m to 10 mm. The stencil is produced by applying a coating liquid over a surface of a thermoplastic resin film to form a coated layer, and drying the coated layer. The coating liquid has a viscosity of 80-250 cp at 25.degree. C. and contains a resin and fibers having an average length in the range of 30 .mu.m to 10 mm.
Mori, Tomiya. (1999). Heat-sensitive stencil and method of fabricating same (U.S. Patent No. 5908687). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5908687
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile