The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1999
Filed:
Sep. 30, 1996
Yasunao Miura, Nagoya, JP;
Masakazu Murata, Oobu, JP;
Nippondenso Co., Ltd., Kariya, JP;
Abstract
The present invention provides a die for molding a honeycomb structure, which can be molded without causing bending on a cell grid and which can readily cope with changes of shrinkage percentage of the product. The invention also provides a honeycomb structure, which has no bending on the cell grid and has high strength. The die according to the present invention includes a metal die 1, having a feed hole forming unit 14 provided with feed holes 15 and a slot forming unit 11 provided with slots 12, and a guide ring 2, which has an abutment surface 25 placed face-to-face to a part of the metal die 1 via a clearance sector 22. The slot forming unit includes an outer peripheral slot forming unit 130 and a main-body slot forming unit 160, and there is provided a protruded surface 17 protruded in extruding direction between a main body end surface 16 and an outer peripheral end surface 13. The shortest linear distance 'd' between the protruded surface 17 and the guide ring 2 is greater than the clearance distance 'c' of the clearance sector.