The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1999
Filed:
Jun. 23, 1997
Mutsuo Akao, Kanagawa, JP;
Fuji Photo Film Co., Ltd., Kanagawa, JP;
Abstract
Injection molding is carried out by using styrene-based resin composition. As to the styrene-based resin composition, styrene-based resin, in which melt flow index is 3.0-40.0 g/10 minutes, a Rockwell hardness is M38 or more, an Izod impact strength is 2.0 Kg.multidot.cm/cm or more, a bending elastic modulus is 20,000 Kg/cm.sup.2 or more, and a Vicat softening point is 78.degree. C. or more, is 50 wt. % or more, total of at least two kinds selected from lubricant or surfactant is 0.01-20 wt. %, a thermoplastic resin having experienced twice or more heat histories at 150.degree. C. or more is 3 wt. % or more, and total of at least one of antioxidant, deodorant and an agent imparting fragrance is 0.01-20 wt. %. Styrene-based resin composition having melt flow index of 1-50 g/10 minutes, and including ethylbenzene of 0.001-1 wt. %, rubber-like material of 0.1-15 wt. %, and light shielding material of 0.1-10 wt. %, may be used.