The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 1999
Filed:
Dec. 24, 1996
Applicant:
Inventor:
Koichi Sagara, Tochigi-ken, JP;
Assignee:
Kao Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29D / ; B29D / ;
U.S. Cl.
CPC ...
264-133 ; 264106 ; 425810 ;
Abstract
A prescribed molded substrate is molded out of a melted resin with a stamper having projections for forming pits with the shape of the projections preliminarily set to be greater than the shape of pits of the substrate to be molded. The relationship between the height H of the projections for forming the pits to the stamper and the depth d of the molded substrate is such that H/d=1.3 to 1.8.