The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 25, 1999

Filed:

May. 27, 1997
Applicant:
Inventors:

Katsuhisa Tonooka, Kanagawa, JP;

Chuichi Sato, Kanagawa, JP;

Hiroyuki Nojima, Kanagawa, JP;

Yuichi Sumita, Kanagawa, JP;

Shoji Jibu, Kanagawa, JP;

Assignee:

NSK Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451 50 ; 451 24 ; 451 79 ; 384 99 ; 384 12 ;
Abstract

A ball polishing method includes the steps of rotating one of two plates through use of a rotating mechanism while balls are sandwiched between the plates, pressing one of the two plates against the other plate via a guide slide mechanism for guiding one of the two plates to the other plate by means of a pressing mechanism, and polishing the balls while the pressing force is regulated through use of a pressing force control mechanism. The method is further provided with rotary support means for supporting the rotating mechanism and guide support means for supporting the guide slide mechanism, and at least one of them utilizes hydrostatics. By virtue of this method, a machining pressure can be controlled with a high degree of accuracy, and the accuracy of polishing of balls can be improved.


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