The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Feb. 03, 1997
Seiji Ichikawa, Tokyo, JP;
Tomoaki Hirokawa, Tokyo, JP;
Tomoaki Kimura, Tokyo, JP;
Junichi Tanaka, Tokyo, JP;
Taku Sato, Tokyo, JP;
Satoshi Murata, Tokyo, JP;
Tsutomu Kubota, Tokyo, JP;
Takeo Ogihara, Tokyo, JP;
Kenji Uchida, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.