The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Oct. 07, 1994
Applicant:
Inventors:
Jong Hyun Lee, Taegu, KR;
Woo Jeong Kim, Kyungki-Do, KR;
Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437228 ; 437245 ; 437246 ; 437921 ; 437927 ; 73654 ; 7351401 ; 7351434 ;
Abstract
A mass manufacturing method of semiconductor acceleration and vibration sensors uses a dispensing method, a electrical plating method, a screen-printing method or a preforming method in manufacturing a mass made of metal pastes in a desired size and amount on a mass pad of a thin metal film which is formed on a beam in a given pattern, so that it can be adapted to the mass-production of the sensors having the mass of the desired amount and size.