The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Mar. 26, 1997
Masatoshi Ohara, Tokyo, JP;
Takeo Ogihara, Tokyo, JP;
Satoshi Murata, Tokyo, JP;
Kenji Uchida, Tokyo, JP;
Tsutomu Kubota, Tokyo, JP;
Seiji Ichikawa, Tokyo, JP;
Tomoaki Hirokawa, Tokyo, JP;
Tomoaki Kimura, Tokyo, JP;
Taku Sato, Tokyo, JP;
Junichi Tanaka, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.