The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Jun. 11, 1997
Barry E Burke, Lexington, MA (US);
Bernard B Kosicki, Acton, MA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Abstract
A hybrid integrated circuit and method of fabricating a hybrid integrated circuit. A first wafer is provided having a first surface with a first electrical contact for a first active circuit associated therewith and a second surface. A second wafer is provided having a third surface with a second electrical contact for a second active circuit associated therewith and a fourth surface, the second wafer being chemically thinned at the fourth surface. The first and second wafers are bonded together at an interface between the first and third surfaces such that the first and second electrical contacts are relatively aligned with one another. The fourth surface of the second wafer is processed to define an access via to both the first and second contacts. An electrical interconnection is formed between the first and second contacts within the access via so that the first and second active circuits are electrically interconnected.