The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Apr. 08, 1997
Henry L Humphrey, The Colony, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method of bonding wires which includes providing at least a first and second pair of bonding locations, one of each pair of bonding locations being subject to flexure in response to the application of a force thereagainst. A clamping force is applied against at least one of the bonding locations subject to flexure and a wire bond is formed to the first bonding locations subject to flexure. The clamping force is removed from the first bonding location subject to flexure and a clamping force is applied against the second of the bonding locations subject to flexure. A wire bond is formed to the second of the bonding locations subject to flexure and the clamping force is removed from the second of the bonding locations subject to flexure. The bonding steps include providing a first capillary and causing the first capillary to perform the step of bonding in a predetermined direction and providing a second capillary and causing the second capillary to perform the step of bonding in a direction normal to the predetermined direction. Preferably there are a plurality of first pairs of bonding locations and a plurality of second pairs of bonding locations.