The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 1999
Filed:
Jun. 11, 1997
Applicant:
Inventors:
Peter R Ewer, Surrey, GB;
Alex Kamara, Santa Monica, CA (US);
Kevin Smith, Surrey, GB;
Mark Steers, West Sussex, GB;
Arthur Woodworth, Surrey, GB;
Assignee:
International Rectifier Corporation, El Segundo, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
174 524 ; 257713 ; 257675 ; 257676 ;
Abstract
A surface mount semiconductor package includes a semiconductor device, a metal pad on which the semiconductor device is mounted, and a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when cured, where the metal pad includes a waffled surface opposite the surface on which the semiconductor device is mounted for accepting solder between the metal pad and a substrate and for permitting solder wetting therebetween.