The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 1999
Filed:
Nov. 25, 1996
Masami Matsuoka, Kawasaki, JP;
Hikaru Aoyagi, Kawasaki, JP;
Kazuaki Naito, Kawasaki, JP;
Katsunori Saito, Kawasaki, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
There is disclosed a multi-layer laminate molding having a layer structure that a main material layer made mainly of a polyethylenic resin at the outer side and an ethylene-vinyl acetate copolymer saponified product layer or polyamide resin layer at the inner side are laminated through at least an adhesive material layer, the adhesive material layer comprising a resin composition containing (A) 60 to 95% by weight of at least one resin selected from the-group consisting of (1) a high density polyethylenic resin having specified physical properties, (2) a linear low density polyethylenic resin having specified physical properties, (3) a modified high density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the like onto the above (1), and (4) a modified linear low density polyethylenic resin obtained by grafting unsaturated carboxylic acid and the-like onto the above (2), and containing at least 0.1% by weight of (3) and/or (4) and (B) 40 to 5% by weight of a linear ultra low density polyethylenic resin having specified, physical properties said resin composition having a proportion of the unsaturated carboxylic acid and the like grafted of 0.001 to 50% by weight, the difference in acoustic impedance between the main material layer and adhesive material layer being at least 8.5.times.10.sup.-3 g/cm.sup.2 .multidot..mu.sec. This multi-layer laminate molding is excellent in barrier properties, and non-destructive detection of the adhesive material layer can be carried out easily by the supersonic wave reflection method.