The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 04, 1999

Filed:

Apr. 20, 1998
Applicant:
Inventors:

Yorito Ota, Hyogo, JP;

Masahiro Maeda, Osaka, JP;

Shigeru Morimoto, Osaka, JP;

Morio Nakamura, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 361707 ; 361715 ; 361719 ; 257706 ; 257707 ; 257711 ; 257713 ; 257701 ;
Abstract

A semiconductor chip is mounted on the central portion of a metal heat radiator. A pair of metal projecting members are provided on the heat radiator externally of the pair of opposed sides of the semiconductor chip to extend therealong beyond both ends of the semiconductor chip. A circuit board is mounted on the side of each of the pair of projecting members opposed to the semiconductor chip. The top surface of the semiconductor chip and the top surface of each of the projecting members are connected to each other by a third bonding wire for grounding.


Find Patent Forward Citations

Ota, Yorito. (1999). Package and semiconductor device (U.S. Patent No. 5901042). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5901042

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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