The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 1999
Filed:
Dec. 02, 1997
Bill Tempest Davies, Kananta, CA;
Mark Roy Harris, Woodlawn, CA;
Northern Telecom Limited, Montreal, CA;
Abstract
A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an array of conductive leads. A molded body covers the die, and absorbs the majority of the pressure applied when compressing the package between a heatsink and a printed circuit board (PCB). Rigid removable support material surrounds the molded body to keep the package flat while it is being mounted to the PCB. The support material is removed after soldering of the package to the PCB. The invention permits the package to be tightly compressed between a heatsink and a substrate without causing degradation of the conductive connections. Reliability of the connections is further increased since the tape film is flexible enough to accommodate bending of the substrate to which the package is connected.