The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 1999

Filed:

May. 29, 1997
Applicant:
Inventor:

Toshihiro Hanamura, Kyoto, JP;

Assignee:

Rohm Co. Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G / ; H05K / ;
U.S. Cl.
CPC ...
361313 ; 361766 ; 338195 ; 338308 ;
Abstract

Disclosed are a structure and a method of manufacture of a chip composite electronic component with improved moisture resistance. A pair of end electrodes are formed on a surface of the substrate at opposite end portions thereof. An intermediate electrode is formed at a location between the end electrodes on the surface of the substrate. The intermediate electrode includes a lower electrode, a resistor electrode and a pad electrode formed continuous therebetween. Another element is formed on the lower electrode so as to be electrically connected between the lower electrode and one of the end electrodes. A resistance element is formed between the other of the end electrodes and the resistor electrode. A glass layer is formed to cover another element, the resistance element and the pad electrode. A protective layer of a synthetic resin is formed to cover the entire surface of the glass layer and part of each the end electrode.


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Hanamura, Toshihiro. (1999). Chip composite electronic component with improved moisture resistance (U.S. Patent No. 5898563). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5898563

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