The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 1999

Filed:

Apr. 17, 1998
Applicant:
Inventor:

Steven W Wallace, Fleetwood, PA (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438455 ; 438456 ; 438458 ;
Abstract

The specification describes a gettering technique for bonded wafers. The handle wafer is provided with a phosphorus predeposition to getter impurities from the handle wafer. The surface to be bonded of the handle wafer is then polished to prepare the wafer for bonding. During polishing the top side phosphorus layer is removed, thereby eliminating the potential for updiffusion of phosphorus from the gettering layer into the device regions of the device layer. The phosphorus gettering layer on the backside of the handle wafer is retained for additional gettering during the bonding operation and during subsequent processing of the device wafer.


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