The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 1999

Filed:

Feb. 20, 1997
Applicant:
Inventor:

Noriho Terasawa, Nagano, JP;

Assignee:

Fuji Electric Co., Ltd., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M / ;
U.S. Cl.
CPC ...
363132 ; 363 98 ;
Abstract

A power semiconductor module with a bridge circuit is housed in a common case. The module includes a plurality of element chips separated into groups for semiconductor elements, a plurality of drive chips, and a signal processing chip formed as an integrated circuit. Each drive chip is formed as an integrated drive circuit and is connected to each semiconductor element to correspond thereto. Each drive chip operates at a potential corresponding to each semiconductor element. The signal processing chip is connected to the drive chips to be shared commonly by the drive chips. The signal processing chip processes signals associated with the drive chips in such a way that the signals are compatible with the potentials of the drive chips. Cost and performance of the module is improved.


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