The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 1999

Filed:

Sep. 12, 1997
Applicant:
Inventors:

Walter M Hendrix, Richardson, TX (US);

Babi Ati, Plano, TX (US);

Michael Guy, Garland, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 361700 ; 361690 ; 361719 ; 361802 ; 165 803 ; 165185 ; 16510433 ; 174 / ;
Abstract

A circuit board enclosure for housing a plurality of circuit boards has a polymer casing having upper and lower openings and an interior. The circuit board enclosure also has upper and lower heat conductive pieces formed of a metal and fitting respectively within the upper and lower openings in the casing, in a water tight sealed relationship with the casing. The upper and lower heat conductive pieces have heat transfer fins protruding from the openings in the casing. The upper and lower heat conductive pieces have an interior side facing the interior of the enclosure. The interior sides have guide grooves to receive opposing sides of the circuit board. The guide grooves of the upper and lower heat conductive pieces are substantially parallel. The polymer casing may be formed of polycarbonate. The upper and lower heat conductive pieces may be formed of aluminum. The casing may have two upper and two lower holes, with each heat conductive piece having two sets of heat transfer fins fitting respectively through the two holes in the casing.


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