The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Jul. 10, 1997
Fred Hittman, Baltimore, MD (US);
Allan S Gelb, Baltimore, MD (US);
Marcia J Gelb, Baltimore, MD (US);
Thomas N Foreman, Ellicott City, MD (US);
Paul E Kutniewski, Ellicott City, MD (US);
Greatbatch-Hittman, Inc., Columbia, MD (US);
Abstract
Filtered feedthrough assembly (100, 200) is formed by mounting a filter support assembly (130, 130', 230) having a capacitor (110,210) mounted thereto, to a conductive feedthrough (10, 10'). The conductive feedthrough includes a metallic ferrule (14, 14') having a centrally disposed through opening (28) extending between opposing ends thereof. At least one elongate lead wire (12) extends through the ferrule through opening. A hermetic seal insulator (20, 20') is disposed within the central opening of the ferrule and is sealed thereto. The filter support assembly (130, 130', 230) includes an insulative substrate (132, 132', 132') having a first metallization pattern (133, 314) formed on an upper surface (138, 138') thereof. A second metallization pattern (135, 316) is formed on the lower surface (124, 124') of substrate (132, 132', 132'). A capacitive element (110, 210) is electrically coupled between a first metallization area (145, 318) and second metallization area (143,320) of the first metallization pattern (133, 314). The first metallization area (145, 318) is electrically coupled to the lead (12) and the second metallization area (143, 320) is electrically coupled to the ferrule (14, 14'). The second metallization area (145, 318) includes a metallized recess (140, 140') formed in a perimeter edge (134, 134') of the substrate (132, 132', 132'). A conductive contact material (150) is disposed within the recess for providing the electrical connection to the ferrule (14, 14'). A conductive contact material (152) provides the electrical connection between the lead (12) and the first metallization area (145, 318).