The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Mar. 06, 1997
Futoshi Nakanishi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
An adhesive compound layer bonds the reverse surface of a semiconductor chip to a major surface of a substrate, and a restoring compound layer is formed on a top surface of the semiconductor chip; the adhesive compound layer and the restoring compound layer exert a first force on the reverse surface and a second force on the top surface due to shrinkage during a thermosetting so that a first moment due to the first force is reduced or canceled by a second moment due to the second force, thereby preventing the semiconductor chip from undesirable warp.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile