The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 1999
Filed:
Jul. 01, 1998
William P Stearns, Richardson, TX (US);
Nozar Hassanzadeh, Plano, TX (US);
Navinchandra Kalidas, Houston, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A ball grid array package (62) having a deformable metal layer (20) is provided that includes a heat spreader (60), a stiffener (40) having a cavity and mounted to the heat spreader (60), a substrate (22), and a die (50). The substrate (22) includes a dielectric layer (10) with a cavity and cut-outs, the deformable metal layer (20), and a plurality of electrical traces for connection to solder balls. The dielectric layer (10) couples to the stiffener (40) through a second side and to the deformable metal layer (20) through the first side. The deformable metal layer (20) includes a cavity, a power ring (26), a ground ring (24), and a plurality of traces serving as either a ground connection, a signal connection, or a power connection for coupling with the plurality of solder balls. The deformable metal layer (20) also has a plurality of deformable metal layer portions each partially positioned over one of the cut-outs in the dielectric layer (10) and electrically coupled to the stiffener (40) through the cut-out. Each of the plurality of deformable metal layer portions also couples with one or more of the plurality of traces. The die (50) is mounted to the heat spreader (60) through the cavity of the substrate (22) and the stiffener (40). The present invention also provides a method for forming the ball grid array package (62).