The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 20, 1999

Filed:

Feb. 21, 1997
Applicant:
Inventor:

Thomas A Gordon, San Diego, CA (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H05K / ; B32B / ;
U.S. Cl.
CPC ...
156556 ; 228 491 ; 22818022 ; 228185 ; 29740 ; 29834 ; 361777 ;
Abstract

A method and apparatus for aligning an electronic component with a base member where a pattern of contacts on the component are to be bonded to an identical pattern of contacts on the base member. Templates having indentations along one edge shaped to align with the contact pattern on the component and base member can be positioned in alignment with the base member contact pattern along two sides of the pattern and releasably secured in place, such as by tape. The component is placed over the base member with its contacts aligned with the template. This assures precise alignment of the two contact patterns. The assembly can be heated to the melting point of the solder and cooled to bond all of the contacts together. The templates are removed for reuse. With ball grid array components, the template indentations are preferably partially-circular to align with the edge row of round solder contact pads. With linear arrays of short elongated solder pads, preferably the template has plural spaced fingers configured to fit between the solder pads.


Find Patent Forward Citations

Loading…