The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 1999
Filed:
Nov. 20, 1996
Dennis Francis Tianello, Spencerport, NY (US);
David Lawrence Rowden, Rochester, NY (US);
Eastman Kodak Company, Rochester, NY (US);
Abstract
A film re-shaping device for orienting and re-shaping the end of a filmstrip in a desired configuration having, a base, an alignment post mounted on the base, an elongated metal lower die plate with an guide hole for positioning the die plate over the alignment post, formed in the desired end-of-filmstrip configuration, a film guide mounted on the die plate for aligning an edge of the filmstrip, a film edge spring for keeping the filmstrip against the film guide, a spring loaded roller attached to the base for bearing on the filmstrip and flattening the filmstrip against the die plate surface, and an elongated metal upper punch plate having an guide hole for positioning the punch plate over the alignment post and aligning the plates accurately with each other, formed at the film re-shaping end in the desired end-of-filmstrip configuration, whereby the filmstrip is captured between the upper and lower plates, is described. The device has a raised rib formed along the bottom of an outer edge of the end of the punch plate for shearing the filmstrip, removing the damaged portion of the filmstrip and re-shaping the undamaged portion of the filmstrip in the desired end-of-filmstrip configuration. A method of re-shaping the end of a filmstrip using the device is also described.