The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
May. 12, 1998
Eugene J Urda, Binghamton, NY (US);
Magid Fazel, Vestal, NY (US);
Jose R Caceres, Vestal, NY (US);
Daniel G Rice, Owego, NY (US);
Lockhead Martin Corporation, Bethesda, MD (US);
Abstract
A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to center line distances equals the connector offset on a given backplane. Direct connections to both boards of the dual-board structure can thus be made from the backplane to reduce connection length and reliability relating to a mezzanine board mounted on a single-board host. The preferably continuous heat sink frame distributes heat through the structure and to a card cage to avoid hot spots on the printed wiring boards. A mezzanine board and further heat sink may be attached to the dual board host to further increase component mounting area to far greater levels than common industry standards while improving mechanical and electrical integrity and reliability.