The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Aug. 18, 1997
Applicant:
Inventors:
Emily Ellen Hoffman, Carrollton, TX (US);
Judith Sultenfuss Archer, Dallas, TX (US);
Assignee:
Texas Instruments, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257777 ; 257686 ;
Abstract
A three-dimensional semiconductor circuit assembly wherein each of several circuit chips is provided with patterned metal layers that extend from the circuit surface onto an edge side of the chip, then the chips are adhesively bonded to opposite surfaces of one or more dielectric spacers, respectively, whereby the edge sides of the resulting multiple-chip stack are readily connected to metal patterns on a substrate.
Quick Actions:
Hoffman, Emily. (1999). Semiconductor device including stacked chips having metal patterned on (U.S. Patent No. 5892287). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5892287
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile