The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Jul. 24, 1997
Applicant:
Inventor:
Milton L Buschbom, Plano, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257696 ; 257693 ; 257664 ; 257662 ;
Abstract
The invention is to a combination of a semiconductor device and a ground plane on a printed wiring board to provide a controlled impedance signal lead. A printed wiring board has a ground plane layer, and a semiconductor device having a down-set, or deep down-set, lead frame die mounting pad is mounted on the printed wiring board above the ground plane layer. The leads of the semiconductor device form a transmission line in combination with the ground plane, when the leads are placed a controlled distance above the ground plane.