The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 1999
Filed:
Oct. 21, 1996
Yoshikazu Koshiba, Tokyo, JP;
Yasuhide Kuroda, Tokyo, JP;
Yukio Aoki, Tokyo, JP;
Tsuyoshi Minakata, Tokyo, JP;
Masaru Iizuka, Tokyo, JP;
Nippon Yakin KogyoCo., Ltd., Tokyo, JP;
Abstract
Apparatus for applying a coating of a slurry of a powdered solder material and a binder to the inner surface of a hollow metal cylinder. The apparatus includes solder material coating device including a coating nozzle which may be moved between a coating position within the interior of the hollow metal cylinder and a non-coating position; a guide for guiding and transporting a hollow metal cylinder towards the nozzle; means for rotating and supporting the hollow metal cylinder when the nozzle is in the coating position. The solder coated metal cylinder is used, for example, to provide an exhaust gas cleaning metal carrier in which a metal honey inner core is inserted into and soldered by the solder slurry applied to the hollow metal cylinder.