The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 30, 1999

Filed:

May. 31, 1995
Applicant:
Inventor:

Takuya Gentsu, Gamo-gun, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385137 ; 385 65 ; 385 71 ; 385 80 ; 385 83 ;
Abstract

A thin film layer formed of a material having good wetting properties with respect to solder is laid on a joining surface of a second substrate, and at the same time, a thin film layer formed of Au is laid on a joining surface excluding concave grooves of a first substrate, and optical fibers are placed in the concave grooves of said first substrate, and then urged by the second substrate from the upper side thereof to cause the thin film layer on the first substrate to be plastically deformed and joined by a solder. The solder allows the optical fibers to be urged against the concave grooves of the first substrate, and at the same time, the thin film layer which is formed of Au and protruded to the concave groove side allows a change in the volume of the solder and a dislocation of the optical fibers to be prevented, and the optical fibers to be positioned fixedly at a high accuracy in the concave grooves.


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