The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1999
Filed:
Jun. 12, 1997
Satya Prakash Arya, San Jose, CA (US);
A David Erpelding, San Jose, CA (US);
Darrell Dean Palmer, San Jose, CA (US);
Tzong-Shii Pan, San Jose, CA (US);
Surya Pattanaik, San Jose, CA (US);
Victor Wing Shum, San Jose, CA (US);
Yoshio Uematsu, Fujisawa, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed are an electrical connection assembly for a data storage device and a method of fabricating the electrical connection between a transducer termination pad formed on a slider and a suspension having a conductive lead structure. A compliant cantilevered conductive pad is formed at the end of the conductive lead structure. A solder bump is formed on the transducer termination pad, and may be formed subsequent to dicing the sliders. The slider is placed in mechanical contact with the suspension for mechanical support such that the solder bump contacts the cantilevered conductive pad, which cantilevered conductive pad complies with the solder bump to absorb positional errors. Then, the solder bump is heated, preferably by a laser, so as to reflow the solder bump to make an approximately right angle solder fillet joint electrical connection with the cantilevered conductive pad.