The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 30, 1999
Filed:
Apr. 21, 1997
Douglas Wallace Phelps, Jr, Burlington, VT (US);
Edward John Dombroski, Jericho, VT (US);
William Carroll Ward, Burlington, VT (US);
Other;
Abstract
A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base is preferably made from epoxy-glass laminate with conductive layers of a clad composite with preferred resistivity and preferred thermal expansion. Platform bases may be composite metal, stamped in a continuous strip, with platform segments excised during assembly. Another embodiment provides a lead paddle assembly in which two tape application platforms hold an IC in a rigid assembly.