The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Apr. 25, 1997
Applicant:
Inventor:
Seong-Ick Ahn, Seoul, KR;
Assignee:
Daewoo Electronics Co., Ltd., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361719 ; 24563 ; 257727 ; 361704 ;
Abstract
A device for dissipating heat generated from an electronic device package located above an upper face of a printed circuit board. This device can be a heat sink having a base in contact with an upper face of the electronic device package, and at least one fin formed on the base to dissipate the heat from said electronic device package. This device also has a pair of clips for clamping the base of the heat sink to the electronic device package to maintain a close thermal contact between the heat sink and the electronic device package.