The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Apr. 10, 1997
Applicant:
Inventor:
Russell Bell, Austin, TX (US);
Assignee:
Advanced Micro Devices, Ind, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03K / ; H01L / ; H03M / ;
U.S. Cl.
CPC ...
326 82 ; 326 86 ; 326 90 ; 341100 ; 341101 ; 257 48 ;
Abstract
A circuit for communicating between structures of an integrated circuit through a metallized layer is provided in which parallel data bits are bundled into serial data packages, serialized and sent from a structure to the metallized layer. A destination structure receives the serial data package from the metallized layer and deserializes the package back into a parallel set of data bits. The metallized layer may extend over a significant portion of a substrate of a chip as a metallized data plane or metallized clock plane. Moreover, the metallized layer may be coupled to a pin to allow communications between structures of separate integrated circuits.