The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Feb. 28, 1997
Ken'ichi Ohki, Kawasaki, JP;
Kiyoshi Muratake, Kawasaki, JP;
Hidetoshi Inoue, Kawasaki, JP;
Takehisa Tsujimura, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device including: a ceramic base board formed of A1N; a CPU chip and a CMU chip which are flip-chip bonded on a circuit board which includes the ceramic base board; SRAM chips which are die-bonded to the lower major surface of the circuit board; first heat conductive blocks adhesively attached to the CPU chip and the CMU chip; second heat conductive blocks adhesively attached to the upper major surface of the A1N ceramic base board; a resin package; and a heat sink which, adhesively attached on the upper major surface of the resin package, is in close contact with the first heat conductive blocks and the second heat conductive blocks. The heat generated by the CPU chip and the CMU chip is transferred to the heat sink via the first heat conductive blocks and is radiated from the heat sink. The heat generated by the SRAM chips is transferred to the heat sink via the A1N ceramic base board and the second heat conductive blocks and is radiated from the heat sink.