The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Jan. 28, 1997
Applicant:
Inventor:
Toshinari Kondo, Tokyo, JP;
Assignee:
OKI Electric Industry Co., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
436615 ; 438613 ;
Abstract
A method of attaching inner leads to the metal electrodes of an integrated-circuit die, in which the tips of the inner leads are pressed onto the metal electrodes by a heated bonding tool. The heat of the bonding tool softens the tips of the inner leads, enabling the inner leads to be directly pressure-welded to the metal electrodes, without the need for intervening soft metal bumps.
Kondo, Toshinari. (1999). Bumpless method of attaching inner leads to semiconductor integrated (U.S. Patent No. 5885892). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5885892
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile