The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Aug. 25, 1997
Applicant:
Inventors:
Assignee:
Nippon Zeon Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
26427213 ; 26427214 ; 26427215 ; 26427217 ;
Abstract
A molding frame made by molding a thermoplastic norbornene resin which hardly deforms even after repeated use is used for production of electronic part sealed bodies by sealing the electronic devices of integrated circuits such as light emitting diodes, diodes, transistors, LSI devices, IC devices and CCD devices and capacitors, resistors, coils, microswitches and dipswitches with thermosetting resins such as epoxy resins as sealants.
Koushima, Yuji. (1999). Method for producing electronic part sealed body (U.S. Patent No. 5885505). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5885505
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile