The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 23, 1999
Filed:
Oct. 25, 1996
Takao Funamoto, Hitachi, JP;
Gen Nagakubo, Kitaibaraki, JP;
Takashi Mashiko, Hitachi, JP;
Fuminori Ishikawa, Hitachiota, JP;
Tadashi Nishino, Hitachi, JP;
Yusutsugu Yoshimura, Hitachi, JP;
Toshiyuki Kajiwara, Tokyo, JP;
Kenichi Yasuda, Hitachinaka, JP;
Mitsuo Nihei, Hitachi, JP;
Yoshio Takakura, Hitachi, JP;
Hironori Shimogama, Hitachi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.