The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 1999
Filed:
May. 09, 1996
Eiji Kobayashi, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A circuit device, for example, a hybrid integrated circuit device, for improving the positioning accuracy of a frame element is disclosed. At least two thick film electrodes (7a) of circular configuration having a diameter of 0.3 mm or greater are formed on a component mounting surface (7S) of a thick film substrate (7) along outer wall peripheries (5OE) of a bottom surface (5B) of a frame element (5) bonded on the component mounting surface (7S) with an adhesive (6), and raised portions (4a) consisting essentially of solder are formed on the thick film electrodes (7a), respectively. The presence of the raised portions (4a) determines the position of the frame element (5) and prevents positional error of the frame element (5). The thick film electrodes (7a) may be of rectangular configuration which allows stabler positioning of the frame element (5). The thick film electrodes (7a) and raised portions (4a) may be formed along inner wall peripheries of the bottom surface (5B) of the frame element (5).