The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 1999
Filed:
Apr. 21, 1997
Zenpei Fukuda, Otake, JP;
Masashi Okamoto, Otake, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A resin forming nozzle device is disclosed. This resin forming nozzle device is one in which a surface lubricant having mold release properties is continuously introduced to a nozzle face having the discharge openings of resin extrusion orifices, and comprises a feed section for supplying a surface lubricant from the outside, and one or more grooves formed in positions adjacent to the discharge openings of the nozzle face so that they have a width of 10 to 3,000 .mu.m and a depth of 10 .mu.m or greater and at least one end thereof communicates with the surface lubricant feed section. When a resin is formed by using this nozzle device while supplying thereto a surface lubricant having a viscosity of 0.1 to 1,000 cP during use and a surface tension of 40 dyn/cm or less, neither oligomers of the resin nor degradation products of the surface lubricant accumulate on the nozzle surface. Consequently, stable resin forming can be performed for a long period of time without causing breakage of the filaments.