The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 09, 1999

Filed:

Aug. 18, 1997
Applicant:
Inventors:

Paul A Markow, Huntsville, AL (US);

Karl W Shock, Madison, AL (US);

Bradley S Chupp, Madison, AL (US);

Frank R Holmes, Huntsville, AL (US);

Terry P Mach, Madison, AL (US);

Assignee:

DaimlerChrysler Corporation, Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361704 ; 361695 ; 361706 ; 361710 ; 361712 ; 165 803 ; 165 804 ; 165185 ; 257706 ; 257707 ; 257713 ; 257718 ; 174 163 ;
Abstract

A heat sinking module cover for use with a potted electronic module assembly is disclosed. An electronic module assembly contains heat generating electrical components. Typically the electrical components are held in relation to a module housing. The module housing, generally, not only provides support but also acts as a heat sink for heat generating electrical components. The electrical components are covered by a potting compound. The potting compound protects the electrical components from dust or any other particles that could affect the function of the electrical component. The present invention discloses a heat sinking module cover with a support portion and a thermal transfer portion. The heat sinking module cover is positioned with respect to the module housing to form a box-like structure. The thermal transfer portion contacts the potting material directly to provide an additional heat sinking means for the electronic module assembly.


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