The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1999
Filed:
Mar. 28, 1995
Seiko Epson Corporation, Tokyo, JP;
Abstract
A bonding width L between a head frame 5 and a flow path unit 12 in a direction orthogonal to an array of pressure producing chambers 7 is set to 0.5b.ltoreq.L.ltoreq.5a if it is assumed that a distance from the bonding end to the piezoelectric vibration element 2 closest to the head frame 5 is a and that the bonding ends of the head frame 5 interposing the piezoelectric vibration element 2 is b. Cracking of a spacer 6 or separation of the spacer 6 from a resilient plate 4 is prevented by ensuring a rigidity of the head frame 5 necessary for suppressing deformation of the flow path unit 12 and by causing the head frame 5 to absorb internal stresses of the flow path unit 12 caused by ambient temperature change.