The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 02, 1999
Filed:
Nov. 18, 1996
Applicant:
Inventor:
Sun Dong Kim, Choongcheongbuk-Do, KR;
Assignee:
LG Semicon Co., Ltd., Cheongju, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257796 ; 257706 ; 257707 ; 257676 ;
Abstract
An improved plate and column type semiconductor package has a heat sink embedded in a plate, which prevents bending of leads or paddle. The plate includes a plurality of leads and a heat sink which are embedded therein, whereby the mounting of the semiconductor package on the printed circuit board is made easier. A semiconductor chip is attached to the heat sink of the plate and a plurality of metal wires electrically connects a plurality of the leads of the plate and the semiconductor chip.